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The drastic performance, flexibility and energy-efficient requirements of embedded applications drive the system-on-chip integration towards heterogeneous multiprocessor platforms. Electronic System-Level (ESL) design methodologies and tools have emerged to tackle the challenges of such complex SoC designs prior to RTL and silicon availability. In particular, SystemC-based Transaction-Level Modeling (TLM) has matured as a standards-based approach to model SoC platforms for the purpose of software development, system integration and verification. Read the review and then order the book today!

News

01/05/09Hifn Selects CoWare ESL 2.0 Solutions for Design and Performance Optimization of Next-Generation Applied Services Processors
06/09/08CoWare Commits Support for SystemC TLM-2.0 Standard
06/04/08CoWare and Doulos Expand Collaboration
04/07/08NXP and CoWare Establish Strategic Relationship for the Company Wide Deployment of ESL Technologies
03/26/08CoWare and Sonics Release ESL 2.0 Upgrade of Joint Flow

Articles

04/01/08Algorithmic Synthesis Boosts Platform-Based SoC Design and Validation
Chip Design Magazine
Written by: Simon Napper, President and CEO, Synfora
02/15/08IMEC tunes in to software defined radio
EE Times
Written by: R. Colin Johnson
01/21/08CoWare, EVE link virtual platforms to RTL
SCD Source
Written by: Richard Goering
12/03/07Case study of a complex video system-on-chip
EE Times
Written by: Tom De Schutter and Jeff Haight
11/09/07ESL 2.0 Technology Release for the Design of Processor- and Software-Intensive Electronic Platforms
Portable Design

Customer Success

Customer Testimonial: Yamaha

Achieving a Successful ESL Design Methodology Transition: How CoWare Services Helped Toshiba Information Systems (Japan) Corp. to become a "Total Solution Provider"


Presentations and Papers

Using Tenison VTOC to Integrate RTL IP into CoWare High-Performance Virtual Platforms

TLM Peripheral Modeling for Platform-Driven ESL Design: Using the SystemC Modeling Library

Architecture Oriented Performance Optimizations for Bus Based System-on-Chip Designs Using TLM

Advancing Transaction Level Modeling

ConvergenSC/Incisive Design Flow